null Skip to main content

✨ Buy more, save 5% Ends

Microchip Fabrication: A Practical Guide to Semiconductor Processing, Sixth Edition

Microchip Fabrication: A Practical Guide to Semiconductor Processing, Sixth Edition

Was: $136.48
Now: $129.08
New condition
(No reviews yet) Write a Review
Physical book delivery

Shipping calculated at checkout.

Estimated delivery
Adding to cart… The item has been added
Product Details
Author:
Peter Van Zant
Publisher:
McGraw-Hill Education
Publication Date:
January 07, 2014
Number of pages:
576 pages
Language:
English
Binding:
Hardcover
ISBN-10:
0071821015
ISBN-13:
9780071821018

Overview

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The most complete, current guide to semiconductor processing Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors. State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry. COVERAGE INCLUDES: The semiconductor industry Properties of semiconductor materials and chemicals Crystal growth and silicon wafer preparation Wafer fabrication and packaging Contamination control Productivity and process yields Oxidation The ten-step patterning process--surface preparation to exposure; developing to final inspection Next generation lithography Doping Layer deposition Metallization Process and device evaluation The business of wafer fabrication Devices and integrated circuit formation Integrated circuits Packaging


  • | Author: Peter Van Zant
  • | Publisher: McGraw-Hill Education
  • | Publication Date: January 07, 2014
  • | Number of Pages: 576 pages
  • | Language: English
  • | Binding: Hardcover
  • | ISBN-10: 0071821015
  • | ISBN-13: 9780071821018

Categories

Hardcover/Technology & Engineering

Reviews

0 Reviews

Write a Review

No reviews yet.

Share your experience and help another reader choose their next book.

Discover your next great book

Get new releases, reader favourites, and special offers delivered to your inbox.