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SiC Power Module Design: Performance, robustness and reliability (Energy Engineering)

SiC Power Module Design: Performance, robustness and reliability (Energy Engineering)

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Product Details
Author:
Alberto Castellazzi, Andrea Irace
Publisher:
The Institution of Engineering and Technology
Publication Date:
Feb 03, 2022
Number of pages:
360 pages
Language:
English
Binding:
Hardcover/Technology & Engineering
ISBN-10:
1785619071
ISBN-13:
9781785619076

Overview

Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carbide (SiC) MOSFETs and diodes.


  • | Author: Alberto Castellazzi, Andrea Irace
  • | Publisher: The Institution of Engineering and Technology
  • | Publication Date: Feb 03, 2022
  • | Number of Pages: 360 pages
  • | Language: English
  • | Binding: Hardcover/Technology & Engineering
  • | ISBN-10: 1785619071
  • | ISBN-13: 9781785619076

Categories

Hardcover/Technology & Engineering

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