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Wafer Bonding: Applications And Technology (Springer Series In Materials Science, 75)

Wafer Bonding: Applications And Technology (Springer Series In Materials Science, 75)

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Product Details
Author:
Marin Alexe, Ulrich G??Sele
Publisher:
Springer
Publication Date:
Sep 30, 2011
Number of pages:
519 pages
Language:
English
Binding:
Paperback
ISBN-10:
3642059155
ISBN-13:
9783642059155

Overview

  • | Author: Marin Alexe, Ulrich G??Sele
  • | Publisher: Springer
  • | Publication Date: Sep 30, 2011
  • | Number of Pages: 519 pages
  • | Language: English
  • | Binding: Paperback
  • | ISBN-10: 3642059155
  • | ISBN-13: 9783642059155

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