Overview
This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.
- | Author: Xiong Du|Jun Zhang|Gaoxian Li|Yaoyi Yu|Cheng Qian|Rui Du
- | Publisher: Springer
- | Publication Date: Jul 09, 2022
- | Number of Pages: 188 pages
- | Language: English
- | Binding: Hardcover/Technology & Engineering
- | ISBN-10: 9811931313
- | ISBN-13: 9789811931314
