Area Array Package Design
McGraw-Hill
ISBN13:
9780071737739
$158.56
(No reviews yet)
Write a Review
McGraw-Hill
Area Array Package Design
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
- | Author: Ken Gilleo
- | Publisher: McGraw-Hill
- | Publication Date: Oct 24, 2003
- | Number of Pages: 220 pages
- | Binding: Paperback or Softback
- | ISBN-10: 0071737731
- | ISBN-13: 9780071737739
- Author:
- Ken Gilleo
- Publisher:
- McGraw-Hill
- Publication Date:
- Oct 24, 2003
- Number of pages:
- 220 pages
- Binding:
- Paperback or Softback
- ISBN-10:
- 0071737731
- ISBN-13:
- 9780071737739
-
-
-
Sale
-
