Overview
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
- | Author: John H. Lau
- | Publisher: Springer
- | Publication Date: Jun 30, 1994
- | Number of Pages: 556 pages
- | Binding: Hardback or Cased Book
- | ISBN-10: 0442014414
- | ISBN-13: 9780442014414
