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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic Research and Development in Japan

Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic Research and Development in Japan

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Product Details
Author:
K. Otsuka
Publisher:
Springer
Publication Date:
Apr 30, 1993
Number of pages:
242 pages
Binding:
Hardback or Cased Book
ISBN-10:
185166579X
ISBN-13:
9781851665792

Overview

This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.


  • | Author: K. Otsuka
  • | Publisher: Springer
  • | Publication Date: Apr 30, 1993
  • | Number of Pages: 242 pages
  • | Binding: Hardback or Cased Book
  • | ISBN-10: 185166579X
  • | ISBN-13: 9781851665792

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