Mems Packaging Technologies And 3D Integration

This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

• | Author: Seonho Seok
• | Publisher: Mdpi AG
• | Publication Date: Jun 01, 2022
• | Number of Pages: 210 pages
• | Language: English
• | Binding: Hardcover/Science
• | ISBN-10: 3036542582
• | ISBN-13: 9783036542584