Overview
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
- | Author: Marin Alexe
- | Publisher: Springer
- | Publication Date: May 14, 2004
- | Number of Pages: 504 pages
- | Binding: Hardback or Cased Book
- | ISBN-10: 3540210490
- | ISBN-13: 9783540210498
