Simulation and Reliability Assessment of Advanced Packaging

Topics covered in this reprint include material characterization, theoretical and empirical methods, modeling, simulation technology, design and validation, and AI-assisted design-on-simulation technology for electronic packaging. Package design engineers, researchers, and graduate students involved in thermal/mechanical modeling, package design, material selection, qualification, and reliability assessment of advanced packaging will benefit from this reprint.

• | Author: Kuo-Ning Chiang
• | Publisher: MDPI AG
• | Publication Date: Apr 30, 2024
• | Number of Pages: NA pages
• | Language: English
• | Binding: Hardcover
• | ISBN-10: 3725809720
• | ISBN-13: 9783725809721