Overview
- | Author: Yan Li, Deepak Goyal
- | Publisher: Springer
- | Publication Date: Feb 10, 2021
- | Number of Pages: 639 pages
- | Language: English
- | Binding: Hardcover
- | ISBN-10: 9811570892
- | ISBN-13: 9789811570896
3D Microelectronic Packaging: From Architectures To Applications (Springer Series In Advanced Microelectronics, 64)
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Springer
3D Microelectronic Packaging: From Architectures To Applications (Springer Series In Advanced Microelectronics, 64)
Product Details
- Author:
- Yan Li, Deepak Goyal
- Publisher:
- Springer
- Publication Date:
- Feb 10, 2021
- Number of pages:
- 639 pages
- Language:
- English
- Binding:
- Hardcover
- ISBN-10:
- 9811570892
- ISBN-13:
- 9789811570896
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