Introduction to Microelectronics Advanced Packaging Assurance

This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.

• | Author: Navid Asadizanjani
• | Publisher: Springer
• | Publication Date: Apr 23, 2025
• | Number of Pages: 00183 pages
• | Binding: Hardback or Cased Book
• | ISBN-10: 3031861019
• | ISBN-13: 9783031861017