Sensor Technologies For Civil Infrastructures: Volume 2: Applications In Structural Health Monitoring (Woodhead Publishing Series In Civil And Structural Engineering)

Woodhead Publishing
SKU:
9780081027066
|
ISBN13:
9780081027066
$383.90
(No reviews yet)
Condition:
New
Usually Ships in 24hrs
Current Stock:
Estimated Delivery by: | Fastest delivery by:
Adding to cart… The item has been added
Buy ebook
Sensor Technologies for Civil Infrastructure, Volume 2: Applications in Structural Health Monitoring, Second Edition, provides an overview of sensor applications and a new section on future and emerging technologies. Part one is made up of case studies in assessing and monitoring specific structures such as bridges, towers, buildings, dams, tunnels, pipelines, and roads. The new edition also includes sensing solutions for assessing and monitoring of naval systems. Part two reviews emerging technologies for sensing and data analysis including diagnostic solutions for assessing and monitoring sensors, unmanned aerial systems, and UAV application in post-hazard event reconnaissance and site assessment. Includes case studies in assessing structures such as bridges, buildings, super-tall towers, dams, tunnels, wind turbines, railroad tracks, nuclear power plants, offshore structures, naval systems, levees, and pipelines Reviews future and emerging technologies and techniques including unmanned aerial systems, LIDAR, and ultrasonic and infrared sensing Describes latest emerging techniques in data analysis such as diagnostic solutions for assessing and monitoring sensors and big data analysis


  • | Author: Jerome P. Lynch|Hoon Sohn|Ming L. Wang
  • | Publisher: Woodhead Publishing
  • | Publication Date: Jul 25, 2022
  • | Number of Pages: 724 pages
  • | Language: English
  • | Binding: Paperback/Technology & Engineering
  • | ISBN-10: 0081027060
  • | ISBN-13: 9780081027066
Author:
Jerome P. Lynch, Hoon Sohn, Ming L. Wang
Publisher:
Woodhead Publishing
Publication Date:
Jul 25, 2022
Number of pages:
724 pages
Language:
English
Binding:
Paperback/Technology & Engineering
ISBN-10:
0081027060
ISBN-13:
9780081027066