Embedded And Fan-Out Wafer And Panel Level Packaging Technologies For Advanced Application Spaces : High Performance Compute And System-In-Package
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Embedded And Fan-Out Wafer And Panel Level Packaging Technologies For Advanced Application Spaces : High Performance Compute And System-In-Package

Wiley-IEEE Press
SKU:
9781119793779
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ISBN13:
9781119793779
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Description
  • | Author: Steffen Kröhnert, Beth Keser
  • | Publisher: Wiley-IEEE Press
  • | Publication Date: Dec 29, 2021
  • | Number of Pages: 320 pages
  • | Language: English
  • | Binding: Hardcover
  • | ISBN-10: 1119793777
  • | ISBN-13: 9781119793779
Additional Information
Author:
Steffen Kröhnert, Beth Keser
Publisher:
Wiley-IEEE Press
Publication Date:
Dec 29, 2021
Number of pages:
320 pages
Language:
English
Binding:
Hardcover
ISBN-10:
1119793777
ISBN-13:
9781119793779
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