Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. It helps the reader predict and minimize, at the design stage and using analytical modeling concepts and approaches, the stresses and strains in solder joint interconnects of IC devices--

• | Author: Ephraim Suhir
• | Publisher: CRC Press
• | Publication Date: January 28, 2021
• | Number of Pages: 406 pages
• | Language: English
• | Binding: Hardcover
• | ISBN-10: 113862473X
• | ISBN-13: 9781138624733