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Proceedings Of The Munich Symposium On Lightweight Design 2021: Tagungsband Zum Münchner Leichtbauseminar 2021 (English And German Edition)

Springer Vieweg
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9783662652152
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ISBN13:
9783662652152
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Every year, the Technical University of Munich, the Universität der Bundeswehr München, and the University of Applied Sciences in Munich invite researchers and practitioners to join the Munich Symposium on Lightweight Design. Experts from industry and academia discuss design tools, applications, and new developments. Topics include, e.g., composite structures, SHM, microstructures, material modelling, design for additive manufacturing, numerical optimization and in particular topology optimization in aerospace, automotive and other industries. The talks are summarized in short articles and presented in this volume.


  • | Author: Jasper Rieser|Felix Endress|Alexander Horoschenkoff|Philipp Höfer|Tobias Dickhut|Markus Zimmermann
  • | Publisher: Springer Vieweg
  • | Publication Date: Jul 13, 2022
  • | Number of Pages: 226 pages
  • | Language: English
  • | Binding: Paperback/Technology & Engineering
  • | ISBN-10: 3662652153
  • | ISBN-13: 9783662652152
Author:
Jasper Rieser, Felix Endress, Alexander Horoschenkoff, Philipp Höfer, Tobias Dickhut, Markus Zimmermann
Publisher:
Springer Vieweg
Publication Date:
Jul 13, 2022
Number of pages:
226 pages
Language:
English
Binding:
Paperback/Technology & Engineering
ISBN-10:
3662652153
ISBN-13:
9783662652152