Sensor Technologies For Civil Infrastructures: Volume 1: Sensing Hardware And Data Collection Methods For Performance Assessment (Woodhead Publishing Series In Civil And Structural Engineering)

Woodhead Publishing
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9780081026960
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ISBN13:
9780081026960
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Sensor Technologies for Civil Infrastructure, Volume 1: Sensing Hardware and Data Collection Methods for Performance Assessment, Second Edition, provides an overview of sensor hardware and its use in data collection. The first chapters provide an introduction to sensing for structural performance assessment and health monitoring, and an overview of commonly used sensors and their data acquisition systems. Further chapters address different types of sensor including piezoelectric transducers, fiber optic sensors, acoustic emission sensors, and electromagnetic sensors, and the use of these sensors for assessing and monitoring civil infrastructures. The new edition now includes chapters on machine learning methods and reliability analysis for structural health monitoring. All chapters have been revised to include the latest advances in materials (such as piezoelectric and mechanoluminescent materials), technologies (such as LIDAR), and applications. Describes sensing hardware and data collection, covering a variety of sensors including LIDAR Examines fiber optic systems, acoustic emission, piezoelectric sensors, electromagnetic sensors, terahertz technologies, ultrasonic methods, and radar and millimeter wave technology Covers strain gauges, micro-electro-mechanical systems (MEMS), multifunctional materials and nanotechnology for sensing, and vision-based sensing and lasers Includes new chapters on machine learning methods and reliability analysis


  • | Author: Jerome P. Lynch|Hoon Sohn|Ming L. Wang
  • | Publisher: Woodhead Publishing
  • | Publication Date: Jul 25, 2022
  • | Number of Pages: 676 pages
  • | Language: English
  • | Binding: Paperback/Technology & Engineering
  • | ISBN-10: 008102696X
  • | ISBN-13: 9780081026960
Author:
Jerome P. Lynch, Hoon Sohn, Ming L. Wang
Publisher:
Woodhead Publishing
Publication Date:
Jul 25, 2022
Number of pages:
676 pages
Language:
English
Binding:
Paperback/Technology & Engineering
ISBN-10:
008102696X
ISBN-13:
9780081026960