3D Microelectronic Packaging: From Architectures To Applications (Springer Series In Advanced Microelectronics, 64)
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3D Microelectronic Packaging: From Architectures To Applications (Springer Series In Advanced Microelectronics, 64)

Springer
SKU:
9789811570896
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ISBN13:
9789811570896
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Description
  • | Author: Yan Li, Deepak Goyal
  • | Publisher: Springer
  • | Publication Date: Feb 10, 2021
  • | Number of Pages: 639 pages
  • | Language: English
  • | Binding: Hardcover
  • | ISBN-10: 9811570892
  • | ISBN-13: 9789811570896
Additional Information
Author:
Yan Li, Deepak Goyal
Publisher:
Springer
Publication Date:
Feb 10, 2021
Number of pages:
639 pages
Language:
English
Binding:
Hardcover
ISBN-10:
9811570892
ISBN-13:
9789811570896
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